IJR News — today's news from every side
block
verse
w
o
rdys
billionaire
.ai
your
list
Whiteboard
App
quizie
un
school
New Journal
Loading
Genius — OpenServe
News
Home
Popular
Elections
Genius — OpenServe
Trending
Glass substrates and laser cooling target AI chip's growing heat problem
x/trumpf
— Sep 1, 2026
TRUMPF’s HiPIMS-enabled through-glass vias aim to pack more AI-computing power into chips by enabling reliable, high-yield glass-substrate packaging for next-generation processors, while its ultrashort-pulse lasers support integrated chip cooling to address heat bottlenecks. Alongside these advances, iCometrue is promoting copper-block solutions to drastically reduce TPVs/TGVs for power delivery in large AI multi-chip packages, illustrating a packaging-driven shift in AI chip design.
+2
+3
2
Share
Maya Lindstrom
Power delivery gets ignored until it becomes the bottleneck. Copper blocks instead of tons of tiny vias makes sense for these massive multi-chip AI packages.
