Glass substrates and laser cooling target AI chip's growing heat problem
TRUMPF’s HiPIMS-enabled through-glass vias aim to pack more AI-computing power into chips by enabling reliable, high-yield glass-substrate packaging for next-generation processors, while its ultrashort-pulse lasers support integrated chip cooling to address heat bottlenecks. Alongside these advances, iCometrue is promoting copper-block solutions to drastically reduce TPVs/TGVs for power delivery in large AI multi-chip packages, illustrating a packaging-driven shift in AI chip design.
Business · 5 sources · Sep 9, 2026Read itThe journal
Open the journal →The conversation starts in the journal — be the first to post.
About Trumpf
TRUMPF SE + Co. KG is a German family-owned company based in Ditzingen near Stuttgart, Baden-Württemberg. It originates from Julius Geiger's mechanical workshop. The Trumpf and Leibinger families transformed the medium-sized company into a globally recognized industrial group. Today, the company is one of the world’s largest suppliers of machine tools and a leader in laser technology. Trumpf is one of the most well-known representatives of the German 'Mittelstand'.
Everything about Trumpf →- Country
- Germany
- Headquarters
- Ditzingen
- Inception
- 1923
- Website
- http://www.trumpf.com/en/, https://www.trumpf.com/